Title Sponsor

 
PackAge Conference 2009  



Packaging for Changing Markets

Venue: Stein Auditorium, India Habitat Centre,
Lodhi Road, New Delhi

The PackAge Conference was held from 9-10 July 2009

The papers presented can be downloaded here:

Packaging: Sustaining the Asian Environment
Bernd Buesing,
Nestle Singapore (Pte) Ltd.

(PDF - 1,013 KB )

Sustainable Packaging Solutions for Edible Commodities with Polyolefins
Dr. U K Saroop,
Reliance Industries Limited.

(PDF - 4,158 KB )

Concepts In Sustainability - MilkPackaging Case Study, Dairy Farmer
to Consumer

Ravi Teja,
SIES School of Packaging

(PDF - 425 KB )

Green Printing and Packaging Solutions
Aleix Mas,
Comexi Group

(PDF - 1,845 KB )

Innovative and Sustainable Fluid Management Solutions for the Food Packaging Industry
David Hill,
Technical Absorbents Ltd.

(PDF - 224 KB )

Value Addition in a Global World
Jagmohan Mongia,
Uflex Limited

(PDF - 6,920 KB )

Advanced Color Management Systems
Nick Price,
Kodak - Singapore Pte Ltd.

(PDF - 2,020 KB )

Advances in Plate Making
Mahesh Kode,
DuPont Packaging Graphics

(PDF - 5,767 KB )

EB Curing Top Coat Systems for Surface Printed Substrates
Santosh Acharekar,
Henkel CAC Pvt. Ltd.

(PDF - 517 KB )

EB Technology for Fast, Safe Curing of Inks
Imtiaz Rangwala,
Energy Science INC.

(PDF - 2,033 KB )

Lean Work Flow
Antony Conway,
Esko- Graphics Pte Ltd.

(PDF - 3,523 KB )

Delivery of Cost Effective Innovation
Prabuddha Dasgupta,
Hindustan Unilever Limited

(PDF - 696 KB )

Lean Innovation in Polymeric Films
Ranjit Singh,
Polyplex Corporation Limited

(PDF - 820 KB )

New Innovations in Packing Systems
Avinash Bangale,
Bosch Limited

(PDF - 1,851 KB )

Innovations in Stand Up Pouches
Jonathan Fowle,
Innovati.

(PDF - 2,321 KB )

Non Clonable Security Systems For Packaging
Raman Nanda,
Bilcare Technologies

(PDF - 1,312 KB )

Value Added Supply Chain Solutions
R Mishra,
Indofil Chemicals Company

(PDF - 63 KB )

Trace and Track Solutions for Security and Logistics Management
Harveer Singh Sahni,
Weldon Celloplast Limited

(PDF - 173 KB )

Automated system and new technology of In-molding labeling
Nandkumar T.,
Wittmann Automation India Pvt Ltd.

(PDF - 7,041 KB )

 

 

Sponsors:


 


   
PackPlus 2010 3-6 December, 2010, Pragati Maidan, New Delhi, India

 

 

PackPlus 2010 3-6 December, 2010, Pragati Maidan, New Delhi, India