Information on Conclave 2019 will soon be available.

The International Packaging Conclave is a knowledge sharing interactive platform for the packaging industry that comes together with the PackPlus in New Delhi every year

The seventh edition of the International Packaging Conclave was held concurrently with PackPlus 2018, in New Delhi on July 27, 2018. The subject of the conclave was “Safe Packaging – New Regulatory Landscape”. It aimed to address the challenges for the food and packaging industryarising out of the new Food Safety & Standards (Packaging) Regulations about to be notified byFSSAI. The announcement of the proposed move by BIS to ban the use of Toulene based inks forfood contact packaging was also highlighted.

Click here to download International Packaging Conclave 2018 Report

Click here to view glimpses of International Packaging Conclave 2018

Click here to view videos and presentations