The International Packaging Conclave is a knowledge sharing interactive platform for the packaging industry that comes together with the PackPlus in New Delhi every year
The seventh edition of the International Packaging Conclave was held concurrently with PackPlus 2018, in New Delhi on July 27, 2018. The subject of the conclave was “Safe Packaging – New Regulatory Landscape”. It aimed to address the challenges for the food and packaging industryarising out of the new Food Safety & Standards (Packaging) Regulations about to be notified byFSSAI. The announcement of the proposed move by BIS to ban the use of Toulene based inks forfood contact packaging was also highlighted.